| 摘要 |
PURPOSE: To provide a semiconductor device formed by mounting two stacked semiconductor chips or more on a substrate that can layer the semiconductor chips of the same size or the same kinds onto upper and lower stages. CONSTITUTION: The semiconductor device is provided with the substrate; an external electrode terminal provided to the substrate and for electrical connection to an external electrode; the first semiconductor chip whose principal side is arranged with a plurality of electrode pads; the second semiconductor chip whose principal side is arranged with a plurality of electrode pads; and connection wires for connecting the electrode pads and the external electrode terminal. Further, the first and second semiconductor chips are deposited with a deviation so that part of the principal side of the first semiconductor chip is opposed to part of a side opposite to the principal side of the second semiconductor chip and the second semiconductor chip is not overlapped on the electrode pads of the first semiconductor chip.
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