SPIN DRYER FOR FABRICATING SEMICONDUCTOR WAFER

摘要

PURPOSE: A spin dryer for fabricating a semiconductor wafer is provided to reduce the generation of watermark by absorbing effectively the DI(Deionized) water separated from a rotating wafer. CONSTITUTION: A spin dryer for fabricating a semiconductor wafer includes a flow path(24), a plurality of injection holes(28), and a hydrophilic sponge(30). The flow path(24) is formed in the inside of a sidewall of a chamber(20) in order to transfer DI water. The injection holes(28) are formed on the sidewall of the chamber(20) near to the flow path(24) in order to inject the DI water. The hydrophilic sponge(30) is used for absorbing the DI water injected from the injection holes(28).