SEMICONDUCTOR LASER REPAIR EQUIPMENT

摘要

PURPOSE: Semiconductor laser repair equipment is provided to reduce damage to a wafer and prevent the wafer from being contaminated by particles by preventing the door of a wafer loading unit from being shut when the wafer is ejected. CONSTITUTION: A wafer cassette(100) for loading and unloading the wafer(200) is installed in the wafer loading unit. A sensor(301) as a wafer detecting apparatus is located in the front surface of the wafer loading unit. A sensor detection unit receives a wafer detection signal sensed by the sensor and transfers the wafer detection signal to a central processing unit for performing a laser repair process.