发明名称 |
ION BEAM DEVICE, ION BEAM MACHINING METHOD AND HOLDER MEMBER |
摘要 |
PROBLEM TO BE SOLVED: To provide an ion beam device and an ion beam machining method capable of properly removing a ruptured layer from the machined surface of a sample, and to provide a holder member. SOLUTION: This ion beam device is provided with: the holding member 21 for holding the sample 3; and a removing beam source 13 for irradiating a cross section 4 of the sample held by the holder member 21 with an inactive ion beam to remove the ruptured layer on the cross section 4. The beam source 13 is positioned on the holding end side of the sample 3 with respect to the perpendicular line L to the cross section 4, and tilted so as to set the irradiation direction of the inactive ion beam to the cross section 4 at a tilt angleθwith respect to the perpendicular line L. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004047315(A) |
申请公布日期 |
2004.02.12 |
申请号 |
JP20020204028 |
申请日期 |
2002.07.12 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
KODAMA TOSHIO;KADA MASAKATSU;FUJII TOSHIAKI;IWASAKI KOJI;SUGIYAMA YASUHIKO;TAKAGI YASUYUKI |
分类号 |
G01N1/32;G01N1/28;G01N1/34;G21K5/08;H01J37/20;H01J37/30;H01J37/305;H01L21/302;(IPC1-7):H01J37/30 |
主分类号 |
G01N1/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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