| 摘要 |
PROBLEM TO BE SOLVED: To provide a resisting layer jointing material which enables a resistor having a specified resistance value to be formed inside a wiring pattern formed by etching, and a component using the resistance layer jointing material. SOLUTION: The resisting layer jointing material 22 is manufactured by laminating a plurality of layers of a polymer sheet 24 as a base, a non-alloy resisting layer 28 having a specified specific resistance and a conductive sheet 26 having outstanding conductivity. Next the resisting layer jointing material 22 is etched and the resistor having a specified resistance value is formed inside the wiring pattern. Thus the component which is applicable to a printed wiring board, an IC package and the like are manufactured. COPYRIGHT: (C)2004,JPO
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