发明名称 Multichip module and disconnection process has two semiconductor chips in the same housing and a temperature sensor in one chip only
摘要 A multichip module (10) comprises two semiconductor chips (30,50) in the same housing with a temperature unit in one chip which determines whether a disconnection temperature has been reached. This will also give rise to a forced disconnection of the second chip. An Independent claim is also included for a disconnection process as above.
申请公布号 DE10335314(A1) 申请公布日期 2004.02.12
申请号 DE2003135314 申请日期 2003.08.01
申请人 SONY CORP., TOKIO/TOKYO 发明人 NISHINO, YASUJI
分类号 H01L23/58;G11C7/00;H01L23/34;(IPC1-7):H01L23/62;H01L25/065 主分类号 H01L23/58
代理机构 代理人
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