| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve resistance for package cracks due to the reflow of semiconductor device utilizing a base substrate. <P>SOLUTION: In the semiconductor device connecting an external terminal formed on a base substrate, on which an insulation layer and wirings are laminated and a connecting terminal of a semiconductor chip via the wirings, the side surface of the base substrate is sealed with resin or the like. According to this semiconductor device, exposing of a fine gap generated at the side surface of the base substrate can be prevented, and package cracks resulting from water content absorbed from the gap can also be prevented. In addition, corrosion of internal wirings due to water content absorbed from the gap can also be prevented. <P>COPYRIGHT: (C)2004,JPO |
