| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a mounting board, which is capable of improving mounting boards in productivity, by dispensing with an after-cure process of curing resin completely or shortening a curing time in the manufacture of the mounting board by the use of a resin adhesive agent possessing an active function. <P>SOLUTION: In a method of manufacturing the mounting board, where electronic components are mounted on its first furface of a substrate 1 and on a second surface of the rear side of the first survace respectively, solder bonding paste 4 containing a thermosetting resin having an active function and a thermosetting temperature T3 higher than a solder melting temperature T2 is used only on the first surface of the mounting board, where the electronic parts are mounted sooner than the second surface. By this setup, the solder bonding paste 4 can be thermally cured twice; the first time being that the first surface is subjected to a first reflow process (time ta) and the second time being that the second surface is subjected to a second reflow process (time tb), so that thermal cure is promoted to the utmost, and the after-cure process can be dispensed with or a curing time can be shortened. <P>COPYRIGHT: (C)2004,JPO</p> |
