| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be converted into a multi-chip package (MCP) in a chip-sized package (CSP) that does not contain an interposer therein, and a method of manufacturing the same. <P>SOLUTION: The semiconductor device comprises a first IC chip having a main surface; a conductor formed on the main surface of the first IC chip; a second IC chip that has a first surface on which an integrated circuit is formed, and a second surface facing the first surface, and is provided on the main surface of the first IC chip such that the first surface faces the main surface of the first IC chip; an electrode connecting material for electrically connecting the conductor and second IC chip; a columnar conductor that is provided on the conductor and is electrically connected to the conductor; a resin for covering the main surface of the first chip, conductor, and the second and side surfaces of the second IC chip such that it exposes one end of the columnar conductor. <P>COPYRIGHT: (C)2004,JPO</p> |
