| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive film having excellent insulation characteristics in film surface direction when bonding substrates with an electrode and to provide a bonding method of substrates with an electrode. SOLUTION: Substrates with electrodes are bonded by the anisotropic conductive film 5 having an anisotropic conductive film body 5a containing conductive particles 6 and insulation particles 7 each dispersed in an adhesive resin composition layer, and an insulation particle containing layer 5b. The average particle diameter of the insulation particle 7 is 90% or smaller than the average particle diameter of the conductive particle 6. Having the insulation particle 7 between electrodes 3, 3, and between electrodes 4, 4. increases insulation characteristics in the film surface direction. COPYRIGHT: (C)2004,JPO
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