发明名称 Methods of and device for encapsulation and termination of electronic devices
摘要 A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.
申请公布号 US2004029311(A1) 申请公布日期 2004.02.12
申请号 US20020215190 申请日期 2002.08.09
申请人 发明人 SNYDER SHAWN W.;BHAT PAWAN K.;JAISWAL SHEFALI
分类号 H01L21/00;H01L21/44;H01L21/48;H01L21/50;H01L23/02;H01L23/28;H01L23/48;H01L23/52;H01L29/40;H01M2/02;H01M2/06;H01M2/08;H01M2/10;H01M2/30;H01M6/18;H01M6/40;H01M10/04;H01M10/052;H01M10/0585;H01M10/36;(IPC1-7):H01L21/44 主分类号 H01L21/00
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