| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring substrate in which the multilayer wiring substrate of a fine wiring pattern pitch of 10μm or less is manufactured at a low cost, the occurrence of inconsistency in a photolithography process due to warping is prevented, and a problem that a manufacturing process extends over a long period of time due to a long etching time is prevented. <P>SOLUTION: A multilayer wiring structure is formed on a flat metal plate 1. Then the metal plate 1 is removed by etching all over the surface, to leave only a multilayer wiring layer 9. An insulating substrate 11 having an aperture 12 and the multilayer wiring layer 9 are bonded together. Then the apertured part 12 is filled with a conductive adhesive 13, to mount a semiconductor chip 14 and to join a solder ball 17. <P>COPYRIGHT: (C)2004,JPO</p> |
