CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent a rapture of a resistor film by eliminating the local thermal expansion of a dielectric film caused by heat from a resistor in a circuit board having the resistor film on the dielectric film. SOLUTION: In the circuit board, a resistor film 6 and a wiring conductor film 7 are provided in direct contact on a BCB film 3 which is the dielectric film of a microstrip line. Then a recess 10 wherein the thickness of the BCB film 3 immediately under the resistor film 6 is made smaller in comparison with others is formed, and the resistor film 6 is formed on the BCB film 3 in the recess 10. Through the thinned portion, the heat of the resistor film 6 is quickly dissipated to a ground conductor film 2. COPYRIGHT: (C)2004,JPO