| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste increasing the mixing ratio of conductive powder having high reliability or high migration resistance, highly competitive in price by reducing the amount of silver plating, and suitable for forming a soldering electrode, for conductive paste or the like. SOLUTION: This conductive paste is composed of conductive powder containing 65-95 wt% almost spherical silver-covered copper powder in which the surface of copper powder is covered with silver and moreover the surface of it is covered with a 0.02-0.5 wt% fatty acid to the copper powder, 1-10 wt% silver powder having a mean particle size of 7μm or less and a 4-25 wt% low-melting point metal conductive powder, and a binder. COPYRIGHT: (C)2004,JPO
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