发明名称 |
Die paddle for receiving an integrated circuit die in a plastic substrate |
摘要 |
A die paddle for receiving an integrated circuit die in a plastic substrate. The die paddle is defined by a copper film on the plastic substrate and comprises a plurality of via holes through the plastic substrate, a plurality of opening through the copper film, and a gold-containing ring formed on the peripheral portion of the copper film. The outermost openings (and/or the outermost via holes) and the gold-containing ring are separated by a distance of about 1 to about 20 mils.
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申请公布号 |
US2004027814(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20020213077 |
申请日期 |
2002.08.07 |
申请人 |
LIN WEI-FENG;LIU WEI-CHI;WU CHUNG-JU |
发明人 |
LIN WEI-FENG;LIU WEI-CHI;WU CHUNG-JU |
分类号 |
H01L21/58;H01L23/498;(IPC1-7):H05K7/10 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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