发明名称 |
High speed flip chip assembly process |
摘要 |
A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards.
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申请公布号 |
US2004026033(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030636351 |
申请日期 |
2003.08.07 |
申请人 |
PRICE DAVID M.;PIACITELLI CHRISTOPHER J.;LARSON GARY R.;HUOT SHAUN;HAMMOND JAMES S.;CAO MIAOYONG;MAHAN BRUCE P.;WISTEY JOHN G. |
发明人 |
PRICE DAVID M.;PIACITELLI CHRISTOPHER J.;LARSON GARY R.;HUOT SHAUN;HAMMOND JAMES S.;CAO MIAOYONG;MAHAN BRUCE P.;WISTEY JOHN G. |
分类号 |
G06K19/077;H05K1/09;H05K1/16;H05K3/46;(IPC1-7):B32B31/26 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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