Halbleiterbauelement im Chip-Format und Verfahren zu seiner Herstellung

摘要

The invention relates to a semiconductor component in a chip format, comprising a chip that consists of at least one first insulating layer (3) and electrical contact surfaces (2) devoid of said layer. Conductor paths extend along the first insulating layer (3) as far as the base areas (10) of external connection elements (12) and form the base parts of said elements. Column-shaped elevations made of a conductive polymer are disposed on said base parts. Spherules (5) with at least a metallic exterior are placed on the top of the column-shaped elevations and a metal layer is arranged there between.