发明名称 POLISHING PAD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing pad superior in flatness, in-plane uniformity and a polishing speed, and having less variable polishing speed. <P>SOLUTION: This polishing pad has a polishing layer of a resin layer. The resin layer is composed of a polyurethane resin foaming body having fine foam of an average foam diameter not more than 70 &mu;m. The polyurethane resin foaming body includes polyether polyol, polyester polycarbonate polyol or polycarbonate polyol by 50 wt.% or more to the whole polyol compound as alkali resistant polyol. The polishing layer is set to 10 mg or less on a difference in an abrasion loss quantity by a taper abrasion test before and after a 24-hour soaking test to a potassium hydroxide aqueous solution (40 &deg;C) of pH 12.5. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004042244(A) 申请公布日期 2004.02.12
申请号 JP20020358244 申请日期 2002.12.10
申请人 TOYO TIRE & RUBBER CO LTD;TOYOBO CO LTD 发明人 OGAWA KAZUYUKI;KIMURA TAKESHI;KAZUNO ATSUSHI;ONO KOICHI;KOMAI SHIGERU;SHIMOMURA TETSUO
分类号 B24B37/20;B24B37/24;C08G18/10;C08G18/40;C08G18/66;C08G101/00;C08J5/14;C08L75/04;H01L21/304 主分类号 B24B37/20
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