| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the cost of a jig and tool employed for the electrical test of a semiconductor device by making positions of terminals in the semiconductor device common. <P>SOLUTION: A plurality of semiconductor chips 4 are mounted on the surface of a substrate 1 for the semiconductor device. The plurality of semiconductor chips 4 are sealed collectively by resin to form a resin-sealed part 2. A plurality of solder balls 3 are formed on the rear surface of the substrate 1 so that the most approached distance A between solder balls 3 on the neighboring semiconductor chips becomes (n) times the interval B between the solder balls 3 on the semiconductor chip 4 (n is a positive integer larger than 1). The electrical test of the plurality of semiconductor chips 4 is effected, and thereafter, the resin-sealed parts 2 and the substrate 1 are cut to divide the semiconductor chip 4 into several individual pieces. <P>COPYRIGHT: (C)2004,JPO |
