| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an opto-electric printed wiring board for which fiber exposure for optical I/O component connection is facilitated and manufacture is easily performed as well in an opto-electric printed board equipped with an optical fiber inside, and its manufacturing method. <P>SOLUTION: The opto-electric printed wiring board 10 is composed of the optical fiber 12, an optical wiring layer 14 where the optical fiber 12 is laid and an electric wiring layer 16 laminated on the surface where the optical fiber 12 is laid of the optical wiring layer 14. The opto-electric printed wiring board 10 is characterized by being provided with a through-hole 18, and a light incidence / emission part 20 for outgoing or entering light from the end part of the exposed optical fiber 12 is provided on the side edge of the through-hole 18. <P>COPYRIGHT: (C)2004,JPO</p> |
