| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can cope with an acceleration of a speed of a semiconductor with a low cost and superior reliability, even when a wafer is increased in diameter by efficiently and surely connecting an i/o terminal of a semiconductor element to a circuit for re-wiring at a shortest distance. SOLUTION: In the semiconductor device, in which bonding pads, bond fingers and the circuit for re-wiring are disposed on each semiconductor chip on an insulating resin layer 3 formed over the entire surface of a semiconductor wafer formed with the semiconductor chip, the i/o terminal of the chip is connected to the circuit for the re-wiring via a stud bump 5 disposed on the terminal; and the wafer is divided into individual chips; the insulating resin layer is supplied in a state in which an insulating resin layer 3; and a metal layer 1 are formed on a resin base film 2. COPYRIGHT: (C)2004,JPO |
