ELECTRONIC COMPONENT MOUNTED ASSEMBLY

摘要

PROBLEM TO BE SOLVED: To provide an electronic component allowing a capacitor or the like to be arranged in the vicinity of a semiconductor chip while reducing the increase of the mounting area. SOLUTION: Electrode layers 1 and 2 are arranged facing to each other at both sides of a dielectric layer 3 in such a manner as to constitute a capacitor. Lead out electrodes 4 and 5 are formed on the electrode layers 1 and 2. Moreover, through electrodes 6 that are insulated from the electrode layers 1 and 2 are formed and arranged at the lattice points. An electronic component 10 is mounted on a wiring board, and a semiconductor chip is mounted on it. The semiconductor chip is connected with the wiring board through the through electrodes 6, and the semiconductor chip or the wiring board are connected to the lead-out electrodes 4 and 5. COPYRIGHT: (C)2004,JPO