| 摘要 |
PROBLEM TO BE SOLVED: To suppress increase in the viscosity of a solder paste which occurs during a solder-paste printing process. SOLUTION: A solder-paste printing apparatus 1 has a printing-oriented mask 10 having openings 10a each corresponding to each land 6 of a printed wiring board 5, and has a squeegee 12 for rolling from one-side end of the mask 10 to the other-side end of the mask10 solder paste 11 which contains an Sn-Zn-based solder as a solder material and is mounted on the mask 10 mounted on the printed wiring board 5 while being aligned at a predetermined position of the board 5. Further, the solder-paste printing apparatus 1 has a moisture-content controlling means 2 for keeping the moisture content contained in the atmosphere of the inside of a printing space 1a surrounding the solder paste 11 not larger than a predetermined value. COPYRIGHT: (C)2004,JPO
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