| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To further reduce shock, when a capillary goes down in a wire-bonding apparatus. <P>SOLUTION: A bonding head section 10 comprises an ultrasonic transducer 16 having a capillary 14 at the tip; piezoelectric elements 30, 32 that are a pair of complementary operation type expansion/contraction drive elements for relatively moving the ultrasonic transducer 16 to a bond holder 20; a shock detecting sensor 21; and a Z motor 22 for driving the bond holder 20. When one of the piezoelectric elements 30, 32 is driven in the expanding/contracting direction, the other is driven in a compression direction. When the shock detecting sensor 21 detects that the capillary 14 has moved down by the Z motor 22 and comes into contact with the upper surface of a semiconductor chip, the shock detecting sensor 21 stops the drive of the Z motor 22, performs complementary extraction/contraction drive of the piezoelectric elements 30, 32, rocks the ultrasonic transducer 16, and moves the capillary 14 upward. <P>COPYRIGHT: (C)2004,JPO</p> |
