| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic part by which stress concentration on connections is relieved and hermeticity of function elements is ensured. <P>SOLUTION: The electronic part includes a core metal 20 which is made of a metal plate and both sides of which are covered with resin layers 21, a metal core substrate which is provided with electrodes 22 on the side of piezo-electric elements routed on both the sides through a through-pattern 22a penetrating the core metal 20 and pads 23 for mounting, a chip such as piezo-electric element 10 comprising a SAW device, and a metal cap 30 which is mounted on the core metal 20 for sealing the chip. In this case, a high hermeticity of the chip can be realized by arranging the through-patterns 22a of the metal core substrate on the outside of connection (the electrode 22 on the side of the piezo-electric element) between gold bumps 12 and the metal core substrate. Also, its reliability is improved by relieving thermal stress which is generated against the connection between the gold bumps 12 on the chip side and the electrodes 22 on the side of the piezo-electric elements on the side of the metal core substrate due to the difference in the linear expansion coefficient. <P>COPYRIGHT: (C)2004,JPO</p> |
