| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board wherein highly dense wiring can be formed by preventing the formation of a void in the internal plating of a non-through hole formed by a laser or the like, and preventing an increase in conductor thickness accompanying with the elimination of the void. SOLUTION: The printed wiring board is provided with a conductor circuit formed on the surface of an insulation layer and a non-through via formed at one side of both surfaces. The non-through via is filled with copper plating, and the conductor circuit excluding the copper plating in a via hole is made of copper foil. COPYRIGHT: (C)2004,JPO |
