发明名称 DEVELOPING APPARATUS AND DEVELOPING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a developing apparatus and a developing method improved in the uniformity of the size of a resist pattern. SOLUTION: There are provided a wafer rotation mechanism 10, and a wafer rocking mechanism 20 for rocking the whole of the wafer rotation mechanism 10 in one dimensional direction. The wafer rocking mechanism 20 comprises a motor support 4 for mounting and fixing a motor 1, a rail 5 engaged with a rail groove 41 formed at the side of the lower surface of the motor support 4 for enabling the motor support section 4 to be smoothly slidable in one dimensional direction, a guide bar 6 for transmitting a propelling force to slide the motor 1 along the rail 5, and a linear motor 7 being a propelling force supply source to provide the propelling force to the wafer rotation mechanism 10 by sliding the guide bar 6 axially. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004047853(A) 申请公布日期 2004.02.12
申请号 JP20020205107 申请日期 2002.07.15
申请人 RENESAS TECHNOLOGY CORP 发明人 TARUYA SHINJI
分类号 G03F7/30;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/30
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