| 摘要 |
PROBLEM TO BE SOLVED: To provide a leadless chip carrier capable of resin sealing an electronic part and a bonding wire with a simple structure without using a resin sealing frame. SOLUTION: The side wall of a mounting recess 10 is made up of a slant wall 11 extending upward and outward from a bottom 13 thereof and the slant wall has a slant circuit 51 for connecting a bonding pad 50 and an electronic circuit 55. A top surface 15 of an insulating substrate 1 has the electronic circuit 55, an undersurface 17 thereof has a connecting pad 57, and a side 16 thereof has a side circuit 56 for connecting an electronic circuit 3 and the connecting pad. Within the mounting recess, the electronic part 3 and a bonding wire 30 are sealed with a sealing resin 6 without using the resin sealing frame. COPYRIGHT: (C)2004,JPO
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