| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency electronic circuit module which is easy to be manufactured although it can be electromagnetically shielded from outside, and which can be designed with little limitations. SOLUTION: On the front surface of a first printed wiring board 1 having a ground conductor layer 6, chip components 9 and 10, a conductor block 12 arranged along the outer edge of the first printed wiring board 1 and the like are mounted. On the mounting surface side of the first printed wiring board 1, a second printed wiring board 13 having a ground conductor layer 15 is disposed. The ground conductor layers 6 and 15 are electrically connected to each other via part of the chip component 10 and the conductor block 12. By this structure, a high-frequency electronic circuit can be electromagnetically shielded from outside by means of the ground conductor layers 6 and 15. Since the ground conductor layers 6 and 15 are connected to each other via the components mounted on the first printed wiring board 1, they can be manufactured by the same equipment as used for mounting the chip component 10 or the like, and there are little limitations on a site available for grounding. COPYRIGHT: (C)2004,JPO
|
