| 摘要 |
PROBLEM TO BE SOLVED: To prevent the peeling of a footprint and a wiring pattern and a crack generated in a solder connection part when an outer force is added to a printed wiring board on which multipolar surface mounted parts such as BGA are mounted. SOLUTION: The printed wiring board is provided with the round footprints 20 which are formed in a resist opening 70 and on which BGA 90 being the multipolar surface mounted parts that do not have leads are mounted, and with wiring patterns 40 connected to the round footprints 20. The whole wiring patterns 40 are covered by resists 60. Areas and shapes of the footprints 20 are prevented from becoming substantially different from each other. COPYRIGHT: (C)2004,JPO
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