发明名称 Positive photoresist composition
摘要 A photoresist composition comprising a novolac resin in which 3-27 mol % of the hydroxyl group hydrogens are substituted with 1,2-naphthoquinonediazidosulfonyl groups and an alkali-soluble cellulose whose glucose ring substituent groups are substituted with organic groups at a specific rate is used in microprocessing as a positive photoresist and offers many advantages including uniformity, high sensitivity, high resolution, good pattern shape, heat resistance, film retention, substrate adhesion, shelf stability, and high throughput.
申请公布号 US2004029032(A1) 申请公布日期 2004.02.12
申请号 US20030635032 申请日期 2003.08.06
申请人 KATO HIDETO;SOGA KYOKO;FURIHATA TOMOYOSHI 发明人 KATO HIDETO;SOGA KYOKO;FURIHATA TOMOYOSHI
分类号 G03F7/023;(IPC1-7):G03F7/023 主分类号 G03F7/023
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