发明名称 |
Method for selectively metalizing dieletric materials |
摘要 |
Method for selectively metallizing dielectric materials, the method includes: adhesively covering dielectric materials with an activating layer comprising a conductive material, which layer is subsequently structured by way of laser ablation; and using a subsequent laser treatment to structure the activating layer in such a way that discrete conductive structures are formed, which are subsequently metallized.
|
申请公布号 |
US2004026254(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030381508 |
申请日期 |
2003.08.04 |
申请人 |
HUPE JURGEN;KRONENBERG WALTER;KICKELHAIN JORG;MEIER DIETER J. |
发明人 |
HUPE JURGEN;KRONENBERG WALTER;KICKELHAIN JORG;MEIER DIETER J. |
分类号 |
C23C18/16;C25D5/02;C25D5/54;C25D5/56;C25D7/00;H05K3/10;H05K3/18;H05K3/24;(IPC1-7):C25D5/00 |
主分类号 |
C23C18/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|