| 发明名称 |
Light diode arrangement including laser diodes for illumination and signaling has thermal chip connection and light diode module |
| 摘要 |
A light diode arrangement comprises at least two surface-mounted light diode elements (1) in which a light diode chip is attached to a thermally conductive housing (7) and to an electrical connection plate (4) which has a carrier (41) having a highly thermally conductive insert (42) connected to the housing. |
| 申请公布号 |
DE10234995(A1) |
申请公布日期 |
2004.02.12 |
| 申请号 |
DE2002134995 |
申请日期 |
2002.07.31 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
HUBER, RAINER;PLOETZ, LUDWIG |
| 分类号 |
H01L23/367;H01L23/42;H01L33/64;H05K1/02;H05K1/18;H05K3/34;H05K3/40 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
