| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor connection relay member which can be widely used further than the past regardless of the size of a semiconductor chip, and to provide a semiconductor device using the same. <P>SOLUTION: In an MCP 100, a universal spacer chip piece 50 is structured in such a way that it does not overhangs the upper surface of a semiconductor chip 120 when it is arranged on the semiconductor chip 120, and that lengths of bonding wires 114 and bonding wires 134 are the minimum, respectively, based on a distance between pads 112 and 132. <P>COPYRIGHT: (C)2004,JPO |
