| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipating component which has proper adhesion to a radiation fin even after solder-jointing to a ceramic circuit board or packaging by resin sealing, etc. <P>SOLUTION: A deflected plate-like heat dissipation component whose main components are silicon carbide and aluminum is manufactured. The heat dissipation component is sandwiched by a pair of recess/protrusion dies, comprising spherical surfaces facing each other whose surface temperatures are 450°C or higher. The heat dissipating component is deflected by being pressed by stress of 10 kPa or higher for at least 30 seconds at the substantial temperature of the heat dissipation component being 450°C or higher. <P>COPYRIGHT: (C)2004,JPO</p> |
