| 摘要 |
PROBLEM TO BE SOLVED: To provide the analyzing method of result of inspection in the manufacturing process of the semiconductor device, which predicts quality of chips with high accuracy, based on the result of inspection of a defect, an analyzing device, an analyzing program, a recording medium for recording the analyzing program and the manufacturing method of the semiconductor device. SOLUTION: The value (c) of b/a (Killer Rate) in each address is obtained from the total number (a) of addresses (×) wherein the defects exist among 9 pieces of sub regions provided with the addresses and the total number (b) of (F), wherein defects exist among 9 pieces of the sub regions provided with the addresses. Then, the value (f) (Non Killer Rate) of e/d in each addresses are obtained from a total number (d) of the addresses wherein defects do not exist among 9 pieces of sub regions, provided with addresses and the total number (e) of (P) of addresses, wherein no defect exists among 9 pieces of sub regions provided with the addresses. Thereafter, the value of (cxf) (Site Killer Rate) in each addresses is obtained, whereby the inspection of defect is correlated to the inspection of function. COPYRIGHT: (C)2004,JPO
|
