| 摘要 |
PROBLEM TO BE SOLVED: To improve the temperature uniformity of a substrate in a heat treatment apparatus. SOLUTION: The heat treatment apparatus irradiates the substrate 9 with light by a lamp and performes treatment accompanied by heating to the substrate 9. A first auxiliary ring 31, and a second auxiliary ring 32 spread along the outer periphery of the substrate 9 and a light shielding ring 34, are provided. Annular members are supported by the second auxiliary ring 32, a cylindrical member 33 and a supporting part 35. Gaps between surfaces facing the side of the substrate 9 inside recesses 312, 322 and 342 formed at the respective annular members and the surfaces facing the outer side of projections 321 and 331 and a supporting pin 351 formed on the member on a supporting side are designed such that they get close at the time of a low temperature. Thus, even when the respective annular members are expanded by heating, the respective annular members are positioned at prescribed positions when the temperature lowers. As a result, an overlap between the respective ring-like members is designed to be small, and the temperature uniformity of the substrate 9 at the time of heating is improved. COPYRIGHT: (C)2004,JPO
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