| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive useful for assembling a semiconductor element, various electric and electronic parts, substrate adhesion, etc., in which dispersibility of a compound having inhibitory action on migration of an electroconductive metal is improved, the amount of the compound added is reduced so that the migration of an electroconductive filler ion occurring in a printed wiring board, etc., is effectively controlled, a short circuit between electrodes is prevented and electroconductivity per volume is improved. SOLUTION: The electroconductive adhesive mainly comprises an epoxy resin, an epoxy resin curing agent having inhibitory action on migration and an electroconductive filler. COPYRIGHT: (C)2004,JPO
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