DEVICE AND METHOD FOR COATING SUBSTRATES

摘要

The invention relates to a device for coating substrates by means of magnetron sputtering. Said device comprises at least one sputtering source according to the magnetron principle, at least one target (1) which can be placed on an optional electrical potential, a tunnel-shaped, closed magnetic field (5) which is located above the surface and is at least temporarily used as a cathode, at least one electrode which is at least temporarily used as an anode (7), and at least one power supply unit (8) for producing a voltage between the target(s) and the electrode or the associated electrodes, a device (9) for producing magnetic fields being associated with the electrode in such a way that the electrode surface is at least partially penetrated by a magnetic field. According to the invention, the maximum value of the magnetic field component parallel to the electrode surface HII,max is at least 5 % of the maximum value of the magnetic field component parallel to the target surface HII,max.