| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer dicing method capable of preventing the generation adhesive dusts. SOLUTION: After bonding a wafer 1 to a dicing tape 4 by using an adhesive agent, the adhesive strength of the agent is so decreased that it can just stop the wafer 1 from being separated from the dicing tape 4 during the dicing process, and then the wafer 1 is diced. The adhesive strength of the adhesive agent is decreased particularly along the place in the wafer 1 where a groove 6 is formed during the dicing process. The adhesive agent is a UV-hardening adhesive agent whose adhesive strength is decreased by irradiating UV rays to the agent. COPYRIGHT: (C)2004,JPO |
