| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling apparatus for electronic components and a control unit for a motor that can efficiently cool the electronic components without the need for upsizing the control unit even when the number of semiconductor elements is increased and prevent water drops deposited on the surface of a heat sink from dropping onto the upper part of a control board thereby attaining stable operations without causing a fault, malfunction or the like. SOLUTION: The upper heat sink is configured so as to be extended in one direction with a recessed cross-sectional contour, a cooling path 3 extended in one direction with a recessed cross-sectional contour corresponding to the contour above is formed inside the upper heat sink and an inner side face 2b is formed together with an outer side face 2a to the outer faces of the upper heat sink. The upper end of the lower heat sink is configured to be extended in one direction with a recessed cross-sectional contour and to have a recess formed in a way of being fitted to the upper heat sink, and the lower end of the lower heat sink is formed in an arch shape. The outer faces of the lower heat sink are configured to be formed with an inner side face 4b together with an outer side face 4a. COPYRIGHT: (C)2004,JPO
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