| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device reduced in the number of processes without the deterioration of reflectivity of light, and provide an optical apparatus provided with such a semiconductor device. SOLUTION: In a region S where the light-receiving surface of a photodiode is located, respective layers are removed when first wiring 15 and second wiring 17 are patterned and respective layers are also removed after a second interlayer insulation film 13 and a cover insulation film 18 are formed, respectively. Meanwhile, an insulation film 20 for protection is not removed by etching in the region S, where the light-receiving surface of the photodiode is positioned, and an antireflection film 16 is covered with the protective insulation film 20. COPYRIGHT: (C)2004,JPO
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