发明名称 |
Filter device and method for fabricating filter devices |
摘要 |
A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.
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申请公布号 |
US2004029356(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030623068 |
申请日期 |
2003.07.18 |
申请人 |
TIMME HANS-JORG;AIGNER ROBERT;ELBRECHT LUDER;ELLA JUHA SAKARI;POHJONEN KATRI HELENA;TIKKA PASI |
发明人 |
TIMME HANS-JORG;AIGNER ROBERT;ELBRECHT LUDER;ELLA JUHA SAKARI;POHJONEN KATRI HELENA;TIKKA PASI |
分类号 |
H03H3/02;H03H3/08;(IPC1-7):H01L21/30 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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