发明名称 |
Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
摘要 |
A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (-NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.
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申请公布号 |
US2004029045(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030440301 |
申请日期 |
2003.05.19 |
申请人 |
NUNOMURA MASATAKA;OOE MASAYUKI;NAKANO HAJIME;TSUMARU YOSHIKO;UENO TAKUMI |
发明人 |
NUNOMURA MASATAKA;OOE MASAYUKI;NAKANO HAJIME;TSUMARU YOSHIKO;UENO TAKUMI |
分类号 |
G03F7/027;G03F7/023;G03F7/039;H05K1/00;(IPC1-7):G03C1/73;G03F7/16;G03F7/20;G03F7/40 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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