Production of a micromechanical device used in integrated optical arrangements comprises preparing an SOI or EOI substrate having a silicon functional layer, forming a trench extending through the functional layer, and further processing

摘要

Production of a micromechanical device comprises preparing an SOI or EOI substrate having a silicon functional layer (3) provided after applying an oxide layer (2) on a silicon substrate (1) and having an upper layer formed as a sacrificial layer, forming a trench (5) extending through the functional layer up to the oxide layer by anisotropic etching, forming a passivating layer covering the side walls of the trench and subsequently opening the trench base up to the silicon substrate layer by etching, deep etching using plasma etching from the trench base up to the substrate layer, and carrying out isotopic sacrificial layer etching to remove a region of the sacrificial layer.