| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve deterioration in the high-frequency characteristics of a module for optical communication, where a package terminal and a board for mounting a semiconductor functional element are connected by wire bonding. <P>SOLUTION: Using a high-frequency board 4 for bridge connection on which a high-frequency line, e.g. a coplanar line, is formed, a board 5, mounting a semiconductor laser and having a high-frequency line formed on the surface, is connected electrically with a package lead frame 3 thus obtaining a module for optical communication having superior high-frequency characteristics. <P>COPYRIGHT: (C)2004,JPO</p> |
