| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card which increases a measurement precision in a probing test of a semiconductor device. SOLUTION: A plate 23 to be arranged above the tips of two or more probes which are brought into contact with a device to be measured, is made out of insulating material, and has in its inside a first electro-conductive layer 27- a third electro-conductive layer 29 which are made out of conductive material, and wirings P3 as connecting portions for connecting the first-third layers 27-29 which correspond to the probes to be brought into contact with. On a side surface 23a of the plate 23, an exposed part 30 which comes in contact with the probes is formed, and extends along the thickness direction of the plate 23. The exposed part 30 is connected to the first-third layers 27-29 which are inside via the wirings P3, according to the probes which come in contact with. Grounding and power supply in the immediate vicinity of the semiconductor device are intensified, by surface-contacting the touching parts of the probes to the exposed part 30. COPYRIGHT: (C)2004,JPO
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