| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce occurrence of a bonding failure and to make definite the time for replacing a bonding tool by constantly monitoring ultrasonic vibration of the bonding tool in a bonding apparatus using ultrasonic waves. <P>SOLUTION: In the bonding apparatus having a US horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the US horn 3 and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 and an indicator 8 for displaying an output signal from the ultrasonic detector 7, the bonding method is obtained for easily making a good or bad judgement on the bonding state based on the output signal from the ultrasonic detector. <P>COPYRIGHT: (C)2004,JPO</p> |
