| 摘要 |
PROBLEM TO BE SOLVED: To make flatness which is macroscopic geometrical precision and surface roughness which is microscopic precision of a silicon wafer satisfactory. SOLUTION: Etching liquid is prepared by adding a cationic surfactant, an amphoteric surfactant, or an organic macromolecular compound having polar groups, to an aqueous solution of NH<SB>4</SB>OH, NaOH, KOH, or ethylenediamine. After making the temperature of the etching liquid to 20 to 60°C, the silicon wafer is immersed into the etching liquid to carry out etching. COPYRIGHT: (C)2004,JPO
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