发明名称 TRANSFERRING MATERIAL, ITS MANUFACTURING METHOD, AND TRANSFERRED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a transferring material, which has a uniform hardened resin layer having no "repellency", "pinhole", etc., and to provide its manufacturing method, and to provide a transferred product obtained by using the transferring material. SOLUTION: The transferring material having a mold-releasing base film and a transferring layer provided thereon includes a component (A) of thermoadhesive polymer on the transferring layer, a component (B) of ethylene unsaturated compound polymerizeable by activated energy rays, and a component (C) of polymerization initiator. The transferring material includes at least one layer of thermoadhesive hardened resin layers composed of the hardening resin compositions, which satisfies the relationships given by the following equations (1), (2): 0.1≤(Awt)/((Awt)+(Bwt))≤0.6 (1), 0.4≤(Bwt)/((Awt)+(Bwt))≤0.9 (2), where (Awt) shows an amount (weight part) of the component (A), and (Bwt) shows an amount (weight part) of the component (B), and includes the thermoadhesive hardened resin layer on the uppermost surface on the other side of the mold-releasing base film. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004042607(A) 申请公布日期 2004.02.12
申请号 JP20030114818 申请日期 2003.04.18
申请人 KURARAY CO LTD;OIKE IND CO LTD;NIPPON FINE CHEM CO LTD 发明人 KITANO TAKAHIRO;SUZUKI KOICHI;KUBO KEIJI;OGUSHI MASAYASU;TERADA KAZUTOSHI;KAWABATA TSUNEO;KOJIMA MASAKI
分类号 B44C1/17;B32B7/06;B32B27/30;(IPC1-7):B32B27/30 主分类号 B44C1/17
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